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EVG 7200
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EVG 7200
Automated SmartNIL UV Nanoimprint Lithography System

The EVG7200 system leverages EVG's innovative SmartNIL technology and EVG's materials expertise to enable mass manufacturing of micro- and nanoscale structures. The system brings the advanced soft stamp and imprint capability of SmartNIL to larger substrates and smaller geometries, with resolution down to 40 nm in volume production. This enables greater cost-of-ownership (CoO) benefits and realizes the full manufacturing potential of nanoimprint lithography.

Features


  • Volume-proven imprinting technology with superior replication fidelity 

  • Proprietary SmartNIL® technology with multiple-use polymer stamp technology 

  • Integrated imprinting, UV curing, demolding, and working stamp fabrication 

  • Automated cassette-to-cassette handling plus semi-automated R&D mode 

  • Optional top-side alignment 

  • Optional mini-environment 

  • Open platform for all commercially available imprint materials

  • Scalability from R&D to production - System housing for best process stability and reliability

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EVG 620 NT
Mask Alignment System
(semi-automated / automated)

Known for its versatility and reliability, the EVG620 NT provides state-of-the-art mask alignment technology on a minimized footprint area combined with advanced alignment features and optimized total cost of ownership. It is an ideal tool for optical double-side lithography available in semi-automated or automated configuration with optional full-housing Gen 2 solution to meet high-volume production requirements and fab standards. Operator-friendly software, minimized time for mask and tooling changes, as well as efficient worldwide service and support makes it the ideal solution for any manufacturing environment. The EVG620 NT or the fully housed EVG620 NT Gen2 mask alignment systems are equipped with integrated vibration isolation, and achieve excellent exposure results for a wide range of applications, such as exposure of thin and thick resists, patterning of deep cavities and comparable topographies, as well as processing of thin and fragile materials such as compound semiconductors. Furthermore, the EVG’s proprietary SmartNIL technology is supported on both semi-automated and fully automated system configurations.

Features



  • Wafer/substrate size from pieces up to 150 mm/6’’

  • System design supporting versatility of lithography processes

  • Fragile, thin or warped wafer handling of multiple wafer sizes with quick change-over time

  • Automated contact-free wedge compensation sequence with proximity spacers

  • Auto origin function for precise centering of alignment key

  • Dynamic alignment function featuring real-time offset correction

  • Supports the latest UV-LED technology

  • Rework sorting wafer management & flexible cassette system

  • Manual substrate loading capability on automated system

  • Field upgradeable from semi-automated to fully automated version

  • Minimized system footprint and facility requirements

  • Multi-user concept (unlimited number of user accounts and recipes, assignable access rights, different user interface languages)

  • Advanced SW features and compatibility between R&D and full-scale production

  • Agile processing and conversion re-tooling

  • Remote tech support and SECS/GEM compatibility

  • Additional capabilities:Bond alignment
    IR alignment
    Nanoimprint lithography (NIL)

EVG 620NT
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GEMINI® FB
Automated Production Wafer Bonding System

A maximum level of automation and process integration is achieved with the GEMINI automated production wafer bonding system. Wafer-to-wafer alignment and wafer bonding processes up to 200 mm (300 mm) for volume manufacturing are all performed in one fully automated platform. Device manufacturers benefit from increased production output, a high integration level and a wide choice of bonding process methods like anodic, silicon fusion, thermo-compression and eutectic bonding.

GEMINI FB

Features



  • Fully automated and integrated platform for wafer-to-wafer alignment and wafer bonding

  • Configuration options for bottom-side or SmartView alignment

  • Multiple bonding chambers

  • Wafer handling system is separated from bond chuck handling system

  • Modular design with swap-in modules

  • Combines all benefits from EVG's precision aligners and EVG®500 series systems

  • Minimized footprint compared to stand-alone systems

  • Optional process modules:LowTemp™ plasma activation
    Wafer cleaning
    Coat module
    UV bond module
    Bake/chill modules
    Alignment verification module

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Trymax NEO 2000 series

 

The NEO 2000 product line is an advanced plasma ashing/etch system from Trymax Semiconductor Equipment with the latest photoresist removal technology offering exceptional performance at a very competitive price. The NEO 2000 is specifically designed for applications on 100mm to 200mm diameter substrates.

It’s equipped with an ultra-fast transfer platform and is flexible and configurable for handling different dimensions of substrates at the same time with no hardware changes. The NEO 2000 series has a compact modular design and can deliver a high throughput to achieve the lowest Cost of Ownership.

Features


  • 100 / 150 / 200mm substrate size configurable

  • 3 or 4 cassette stations or 2 integrated SMIF’s

  • 5 axis dual arm robot handling with specific substrate grippers

  • 3 different process chamber technologies available:

              - Microwave downstream (2.45 GHz)

              - RF bias (13.56 MHz)

              - Dual Source (Microwave, RF bias)

  • Mechanical throughput >200wph

  • Compact footprint

  • Very low Cost of Ownership

  • Fully digital controlled, devicenet-ethernet

  • Windows based industrial computers

Trymax NEO 2000
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Trymax NEO 3000

The NEO 3000 product line is a long established tool from the NEO range that is used for advanced plasma ashing and etching from Trymax Semiconductor Equipment.

It’s ready for the highest volume of production and adaptable to every production ramp and budget. The NEO 3000 system can be configured with any of the available Trymax NEO process modules and is compatible with substrates up to 300mm in diameter. The small footprint and modular design can be flexibly configured based on your production needs.

The system can be used as a full bridge tool with compatibility to run both 200 and 300mm diameter substrates.


Features


  • 200/300mm substrate size

  • 2 SMIF loaders

  • 5 axis dual arm robot handling

  • 3 different process chamber technologies available:

            - Microwave downstream (2.45 GHz)
            - RF bias (13.56 MHz)
            - Dual Source (Microwave, RF bias)

  • Mechanical throughput >200wph

  • Compact footprint

  • Very low cost of ownership

  • Fully digital controlled, devicenet-ethernet

  • Windows based industrial computers

NEO 3000
EVG Lithography
EVG  IQ Aligner NT

The IQ Aligner NT is the most productive and technically advanced automated mask alignment system for high-volume applications. Featuring the most sophisticated print gab control and zero-assist dual-size wafer processing capability, the system fully addresses high-volume manufacturing (HVM) needs. It provides a 2X increase in throughput and a 2X improvement in alignment accuracy over EVG’s previous-generation IQ Aligner system, giving it the highest throughput of all mask aligners. The IQ Aligner NT surpasses the most demanding requirements for back-end lithography applications while providing up to 30 percent lower cost of ownership compared to competing systems growing out of the highest throughput supported on mask alignment tools.. With advanced wafer alignment run-out control, full-field mask movement capability and high-power UV light source, it is ideally suited for wafer bumping and interposer patterning, thereby serving a variety of advanced packaging types, including wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP), 3D-IC/through-silicon via (TSV), 2.5D interposers, and flip chip.

Features


  • Zero assist bridge tool - dual substrate concept supporting flexibility of production for 200 mm and 300 mm

  • Throughput > 200 wph (first print)

  • Cutting-edge alignment accuracyTop-side alignment down to 250 nm
    Back-side alignment down to 500 nm

  • Broadband intensity > 120 mW/cm² (300 mm wafer)

  • Full Clearfield Mask Movement (FCMM) for flexible pattern positioning and compatibility for darkfield mask alignment

  • Contact-free in-situ mask-to-wafer proximity gap verification

  • Excellent run-out compensation thanks to ultra-flat and fast response temperature-controlled wafer chuck

  • Manual substrate loading capability

  • Rework sorting wafer management and flexible cassette system

  • Remote tech support and GEM300 compatibility

  • Smart process control and data analysis feature [Framework Software Platform]

          - Integrated analysis features for process and machine control
         - Equipment and process performance tracking feature
         - Parallel/queueing task processing feature
         - Smart handling features
        -  Occurrence and alarm analysis
        - Smart maintenance management and tracking

EVG IA Aligner NT
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EVG  520 IS Wafer Bonding

The EVG520 IS single-chamber unit handles wafers up to 200 mm with semi-automated operation for small-volume-production applications. Redesigned based on customer feedback and EV Group's continuous technological innovations, the EVG520 IS features EV Group's proprietary symmetric rapid heating and cooling chuck design. Advantages such as independent top- and bottom-side heater, high-pressure-bonding capability, and the same material and process flexibility as on manual systems contribute to the success of all wafer bonding processes.

Features


  • Fully automated processing with manual loading and unloading including external cooling station

  • Compatible with EVG mechanical and optical aligners

  • Single- or double-chamber automated system

  • Fully automated bond process execution and bond cover movements

  • Integrated cooling station for high throughput

  • Options:

      - High vacuum capability (1E-6 mbar)
     - Programmable mass flow controller
     - Integrated cooling

EVG 520 IS
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CentroTherm Activator 150

The centrotherm c.ACTIVATOR 150 high temperature furnace line has been developed for post implantation annealing of Silicon Carbide (SiC) or Gallium Nitride (GaN) devices. The Activator 150 is available in various versions as R&D and serial production furnace and offers a high process flexibility.

The unique design of the centrotherm metal-free heating allows process temperatures up to 2000 °C and shorter process cycle times. c.ACTIVATOR 150 allows a cost-effective production due to its small footprint and low cost of ownership.

Features


  • High activation rate

  • Minimal surface roughness

  • Temperatures up to 2000°C

  • Processing of wafer sizes from 2“ to 150 mm

  • Batch size 5 or 50 wafers

  • Heating rate up to 100 K/min

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CentroTherm OXIDTOR 150

c.OXIDATOR 150 is a high-temperature furnace, especially designed for the oxidation of silicon carbide (SiC) by centrotherm.

Its capability to run high process temperatures of up to 1500°C and oxidation processes using O2, N2O, NO, NO2 or WetOx atmosphere makes for an excellent combination of flexibility and proven process quality.

Equipped with metal-free heating and double vacuum, c.OXIDATOR 150 is currently the safest ToxGas oxidation furnace on the market.

Features


  • Batch processing of 2“, 3“, 100 mm and 150 mm wafers or any combination

  • Maximum heating rate up to 7.5 K/min

  • Batch size up to 50 (150 mm) wafers

  • Process pressure range from 850 mbar to atmospheric pressure

C-OXIDTOR 150

The centrotherm c.VACUNITE 300 and c.VACUNITE 180 vacuum soldering systems are ideally suited for high volume production facilities with various materials at up to 650°C.

The integrated heating and cooling plates can be individually controlled. With c.VACUNITE 300 and c.VACUNITE 180, the soldered area affected by voids can be reduced to less than 2% while typical reflow soldering systems range at 20%.

The system is ideally suited for production facilities which run fluxless and voidless soldering processes with various gas atmospheres (N2, H2 100, N2/H2 95/5). Wet chemical activation with HCOOH or dry chemical activation with MW plasma for ultra clean soldering joints are optionally available. Even lead free paste or pre-forms can be used without additional flux.

The process control computer comes with a user-friendly touch screen for operating, process profile editing and recipe storing. A serial interface allows to transfer data to PCs for offline programming and remote service monitoring.

Features


  • Process temperature up to 650°C

  • Excellent temperature uniformity

  • Heating ramp up to 40 K/min

  • Cooling rate up to 150 K/min

  • Vacuum level up to 10-1 mbar

  • Very high throughput

  • Large process area: 0.66 m2 (1 in.2)

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CentroTherm VACUNITE 180
C-VACUNITE 180
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